6 pin molex connector pinout install#
Part Number 8 C1 to C6, C21, C23 Ceramic capacitors, 100 pF Kemet C0402C101J5GACTU 8 C7 to C12, C19, C26 Ceramic capacitors, 0.01 ♟ Yaego CC0603KRX7R9BB103 8 C13 to C18, C29, C31 Tantalum capacitors, 4.7 ♟ AVX TAJA475K020RNJ 2 J5, J6 PCB connector headers, 10-position, male, dual-row, 2 mm pitch Molex 87759-1014 2 R1, R2 Thick film chip resistors, 100 kΩ Panasonic ERJ-2RKF1003X 2 RFIN, RFOUT Connectors, 2.9 mm, jack, PCB mount receptacle SRI Connector Gage Company 2-92 1 U1 18 GHz to 44 GHz, gallium arsenide (GaAs), pseudo morphic high electron mobility transistor (pHEMT), 32 dBm (>1 W), microwave monolithic integrated circuit (MMIC) power amplifier Analog Devices ADPA7005AEHZ 2 VDET, VREF PCB connector surface mount technology (SMT) test points Keystone Electronics 5015 2 J1, J2 Connectors, 2.9 mm, jack, PCB mount receptacle, do not install (DNI) SRI Connector Gage Company 2-92 Not applicable Aluminum heat sink, 2.51 in x 1.9 in N/A N/AĮSD (electrostatic discharge) sensitive device. It is recommended to first remove or combine the largest capacitors that are farthest from the device. There may be a scope to reduce the number of capacitors, but the scope varies from system to system. The power supply decoupling capacitors on the ADPA7005-EVALZ represent the configuration that was used to characterize and qualify the device. Multiple vias are used to connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink. Package ground leads and the exposed paddle connect directly to the ground plane. The RF traces are 50 Ω, grounded, coplanar waveguide. The power voltages, ground voltages, gate control voltages, and detector output voltages are accessed through two 8-pin headers (see Table 1). See Table 2 and Figure 3 for the through calibration path performance. J1 and J2 must be populated with RF connectors to use the through calibration path. To calibrate board trace losses, a through calibration path is provided between the J1 and the J2 connectors. The ADPA7005-EVALZ is populated with components suitable for use over the entire −40☌ to +85☌ operating temperature range of the device. The respective RF traces have a 50 Ω characteristic impedance. The RFIN and RFOUT ports on the ADPA7005-EVALZ are populated by 2.9 mm, female coaxial connectors. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. The ADPA7005-EVALZ consists of a two-layer printed circuit board (PCB) fabricated from a 10 mil thick, Rogers 4350B, copper clad mounted to an aluminum heat sink. 1.5 V, 100 mA power supply GENERAL DESCRIPTION.
ADPA7005-EVALZ evaluation board EQUIPMENT NEEDED
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